Dongguan Baisheng Electronic Technology Co., Ltd

GXP120 thick film non inductive medium power resistor, SOT227 package, rated power 120W patent ZL200830102943.0EBG universal medium power resistor, planar non inductive resistor, filter resistor, voltage equalizing resistor, capacitor discharge resistor, etc. It is mainly used in variable speed drive, power supply, control equipment, communication, automatic control, engine control, etc. Technical characteristics When the center temperature of the base plate is ≤ 85 ° C, the rated power of a single resistance structure is 120W. SOT227 molded package, M4 screw blue backplane package. Four leading out terminals, providing five internal structural forms. For the pulse load capacity, see "EBG Power Resistor Pulse Electrical Load Characteristics". Resistance range: 0.1 Ω~1M Ω. Accuracy range: ± 1%~± 10%. Temperature coefficient: it is better to achieve the rated power of 120W at ± 50ppm/° C (25 ° C~105 ° C) and 85 ° C, and the maximum working voltage shall not exceed 500VDC. (1000VDC can be achieved according to customer requirements) Partial discharge: according to customer requirements. Dielectric withstand voltage: 4000VDC, distributed capacitance: 45pF, service life: rated power 1000h, bottom plate temperature 85 ℃, △ R ≤± (1.0% R+0.001 Ω). Humidity resistance: 56 days/40 ℃, RH ≥ 95%, △ R ≤± (0.25% R+0.001 Ω). Thermal shock: MIL-STd-202, method 107, condition F, △ R ≤± (0.3% R+0.001 Ω). High frequency vibration: MIL – Std – 202, method 204, condition D, △ R ≤± (0.2% R+0.001 Ω). Operating temperature range: - 55 ° C~+155 ° C Resistance installation: M4 screw, maximum torque 1.5Nm Outlet installation: M4 screw, maximum torque 1.3Nm Power reduction curve Note: slope of power reduction curve (thermal resistance): 2.86W/° K (0.35 ° K/W), See "Heat Dissipation Requirements for EBG Power Resistor System" for dimensions and structural form Dimensions Min (mm) Max (mm) A31.0031.70B7.808.20C4.104.30D4.00 -- E4.104.30F14.9015.10G30.1030.30H38.0038.20J11.8012.20K8.909.10L0.750.85M12.6012.80N24.4025.40O1.952.05P5.30 -- Applicable standard GB/T5729-2003 Fixed resistors for electronic equipment Part I: General specification MIL-STD-202MIL – R – 39009D Ordering example model Resistance precision temperature coefficient GX P120 50R 5% 150PPM

MXP35 planar non inductive medium power resistor, TO-220 package 35W power patent ZL200830102946.4 specially designed molded packaging structure, small volume, high power, thick film non inductive, in line with VDE0160 and UL94-V0 standards. Technical characteristics The center temperature of the base plate is ≤ 25 ° C, and the rated power is 35W. The standard TO-220 is molded and packaged, and the French blue base plate is installed. The base plate is fixed by an M3 screw to the conductive part and the metal base plate in a standard lead form for insulation, which is easy to install. The resistance package is completely insulated with the heat sink. See "EBG Power Resistor Pulse Electrical Load Characteristics" for pulse load capacity. Specification parameter resistance value range: 0.2 Ω ～ 1M Ω Resistance value accuracy: ± 1% ～ ± 10% (± 0.5% can be produced as required) Temperature coefficient: it is better to achieve ± 50ppm/° C (25 ° C ～ 105 ° C) 25 ° C rated power 35W, maximum working voltage 350VDC. Dielectric withstand voltage: 1800VAC insulation resistance value: minimum 10G Ω instantaneous overload: 2 times rated power, but not more than 1.5 times maximum continuous working voltage, for 5 seconds, Δ R≤(0.3%R+0.001Ω)。 Service life: rated power 2000 hours, MIL – R – 39009D Δ R≤±(1.0%R+0.001Ω)。 Humidity resistance: MIL – Std – 202, Method 106, Δ R≤±(0.5%R+0.001Ω)。 Thermal shock: MIL – Std – 202, Method 107, Condition F, Δ R≤±(0.3%R+0.001Ω)。 Lead out end strength: MIL – Std – 202, method 211, condition A, tensile test 2.4 N, Δ R≤±(0.2%R+0.001Ω)。 High frequency vibration: MIL – Std – 202, Method 204, Condition D, Δ R≤±(0.2%R+0.001Ω)。 Operating temperature range: - 55 ° C~+175 ° C Lead material: anti-oxidation tinned copper wire M3 screw Maximum torque: 0.9Nm Size and structure form Size Min (mm) Max (mm) A12.7014.70B14.5015.00C9.9110.41D3.553.75E5.856.35F2.853.05G1.171.37H ---- 4.00J0.700.86L4.835.33M4.064.82N1.201.40Q0.550.70R2.052.25 Power reduction curve Note: 1 The slope of the power reduction curve (thermal resistance): 0.23W/° K (4.28 ° K/W). See the "Heat Dissipation Requirements for EBG Power Resistor System" for the description. 2. The rated power of MXP35 is 2.50W at room temperature of 25 ° C without the use of heat sink. If the temperature is higher than 25 ° C, the power will be reduced by 0.02W/° K.

The specially designed molded package structure makes this product have an ultra-long creepage distance , which meets the standards of VDE0160 and UL94-V0, and the planar resistance is thick Membrane non-inductive design.

UPT400A is an improved version of UPT400, thick film non-inductive design, block power resistor , and the terminal uses extended high-voltage insulated wire, The creepage distance and space distance between the terminal and the bottom plate, the resistor installation terminal and the terminal are greatly improved. It is used in electrical equipment fields such as power generation, power transmission, and variable speed drives.