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This product achieves miniaturization with a package height of 5.6mm and a thickness of 3.5mm in a crimp type. The molded case locking method is adopted to improve the efficiency of the insertion operation, and the contact part between the terminal and the pin is provided with a groove, which can exert stable contact.
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Product Details
This product achieves miniaturization with a package height of 5.6mm and a thickness of 3.5mm in a crimp type. The molded case locking method is adopted to improve the efficiency of the insertion operation, and the contact part between the terminal and the pin is provided with a groove, which can exert stable contact.
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